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Gas Discharge Tube (GDT) Products
SL1011A/B and SL1411A Series
Soldering Parameters - Re?ow Soldering (Surface Mount Devices)
Re?ow Condition
- Temperature Min (T s(min) )
Pre Heat - Temperature Max (T s(max) )
- Time (Min to Max) (t s )
Average Ramp-up Rate (Liquidus Temp
(T L ) to peak)
T S(max) to T L - Ramp-up Rate
Pb-free assembly
150°C
200°C
60 – 180 seconds
3°C/second max.
5°C/second max.
T P
T L
T S(max)
T S(min)
Preheat
t S
Ramp-up
t P
t L
Critical Zone
T L to T P
Ramp-down
Re?ow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
25
time to peak temperature
(t 25oC to peak)
Time
Peak Temperature (T P )
Time within 5°C of Actual Peak
Temperature (t p )
Ramp-down Rate
Time 25°C to Peak Temperature (T P )
Do not exceed
260 +0/-5 °C
10 – 30 seconds
6°C/second max.
8 minutes max.
260°C
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
280
Recommended Process Parameters:
260
2 4 0
220
200
180
160
1 4 0
120
100
80
60
4 0
20
0
T ime (Seconds)
Preheat T ime
Cooling T ime
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Solder Pot Temperature:
Solder Dwell Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100 ° C
150 ° C
60-180 seconds
280 ° C Maximum
2-5 seconds
Dwell T ime
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
SL1011A/B and SL1411A Series
50
Revised: June 28, 2010
?2010 Littelfuse, Inc.
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their speci?c applications.
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